Tecnolab Smart store
MI13 BGA Reballing Stencil For Xiaomi Redmi 9 Note9 CPU PM6350 PM4250 SM7225 MT6769V MT6358VW PM7250B WCN3991 77040 78190 PA IC
MI13 BGA Reballing Stencil For Xiaomi Redmi 9 Note9 CPU PM6350 PM4250 SM7225 MT6769V MT6358VW PM7250B WCN3991 77040 78190 PA IC
Normaler Preis
€13,00
Normaler Preis
Verkaufspreis
€13,00
Grundpreis
pro
Inkl. Steuern.
Versand wird beim Checkout berechnet
Verfügbarkeit für Abholungen konnte nicht geladen werden
Welcome to our store
We specialize in integrated circuit chips
If you need to purchase more models
Click on the"Add To Cart"
• Shipping Information
Items will be ship within3 daysof payment receive.
working days(2-4 weeks)to receive for most area.
If you do not receive item within 30 working days(5 weeks), please contact us to investigate the case.
The soldering process is complicated,oldering/replacing chips must be operated by engineers who have proficient skills.
As BGA chips are fragile, complicatedly structured, with numerous balls
any slightly faulty positioning
careless temperature-control or incomplete cleaning PCB boards will result in insufficient soldering or missing soldering.
BGA chips are easily get broken by improper soldering. Before buying, you should consider 3 points:
1) Have you bought the right chips?
2) Do you have proper equipment?
3) Are you skillful enough to solder the chips?
